Challenge

To find an alternative to brazed and assembled cold plates that 
minimize the risk of leakage in direct-to-chip liquid cooling 
applications, in order to shrink rack density, reduce electricity cost and improve sustainability.

Solution

Using EOS DMLS technology together with a high-density 
EOS Copper CuCP process, we developed and built unibody 
leakless, gasket less and joint-free cold plates to create fully leak-free, in-server, liquid cooling solutions.

Results

• Leak-free unibody cold plate that can withstand water pressures of 6 bar and above.
• Reduction in CAPEX investment as there are zero tooling costs for different server boards.
• Freedom to design and fabricate mass customized plate thicknesses, fin densities, and locations.